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eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package features ? single channel isolated gate driver ? for 600 v/650 v/1200 v igbts, mosfets, and sic mosfets ? up to 6 a typical peak current at rail-to-rail output ? active miller clamp ? galvanically isolated coreless transformer driver ? wide input voltage operating range ? suitable for operation at high ambient temperature and in fast switching applications ? recognized under ul 1577 with an insulation test voltage of v iso = 3000 v (rms) for 1 s potential applications ? ac and brushless dc motor drives ? high voltage dc/dc-converter and dc/ac-inverter ? induction heating resonant application ? ups-systems ? welding ? solar product type minimum output current and configuration package 1EDC10I12MH 1.0 a with 1.0 a miller clamp pg-dso-8-59 1edc20i12mh 2.0 a with 2.0 a miller clamp pg-dso-8-59 1edc30i12mh 3.0 a with 3.0 a miller clamp pg-dso-8-59 product validation qualified for industrial applications according to the relevant tests of jedec47/20/22. 1edcxxi12mh datasheet please read the important notice and warnings at the end of this document 2.1 www.infineon.com/eicedriver 2017-09-04
description the 1edcxxi12mh are galvanically isolated single channel igbt driver in a pg-dso-8-59 package that provide output currents up to 3 a and an integrated active miller clamp circuit with the same current rating to protect against parasitic turn on. the input logic pins operate on a wide input voltage range from 3 v to 15 v using scaled cmos threshold levels to support even 3.3 v microcontrollers. data transfer across the isolation barrier is realized by the coreless transformer technology. every driver family member comes with logic input and driver output undervoltage lockout (uvlo) and active shutdown. out out control eicedriver tm in+ in+ in- in- gnd1 vcc1 vcc2,h vcc2,l gnd2,l gnd2,h gnd1 vcc1 clamp clamp single channel with clamp eicedriver tm single channel with clamp figure 1 typical application eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package description datasheet 2 2.1 2017-09-04
table of contents table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 pin configuration and functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 2.1 pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 pin functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 3 functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1 supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2 protection features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2.1 undervoltage lockout (uvlo) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2.2 active shut-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2.3 short circuit clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 3.2.4 active miller clamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 3.3 non-inverting and inverting inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.4 driver output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 4 electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.2 operating parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.3.1 voltage supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 4.3.2 logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.3.3 gate driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.3.4 short circuit clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 4.3.5 active miller clamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 4.3.6 dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.3.7 active shut down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5 recognized under ul 1577 (file e311313) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7 application notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 7.1 reference layout for thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.2 printed circuit board guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package table of contents datasheet 3 2.1 2017-09-04
1 block diagram in+ in- gnd1 vcc1 2 3 4 1 7 8 6 5 vcc2 clamp out gnd2 input filter tx uvlo & active filter input filter gnd1 vcc1 uvlo rx 2v & vcc2 & gnd2 vcc2 gnd2 figure 2 block diagram eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package block diagram datasheet 4 2.1 2017-09-04
2 pin configuration and functionality 2.1 pin configuration table 1 pin configuration pin no. name function 1 vcc1 positive logic supply 2 in+ non-inverted driver input (active high) 3 in- inverted driver input (active low) 4 gnd1 logic ground 5 gnd2 power ground 6 vcc2 positive power supply voltage 7 out driver output 8 clamp active miller clamp 1 2 3 4 8 7 6 5 vcc1 in+ in- gnd1 clamp out vcc2 gnd2 figure 3 pg-dso-8-59 (top view) 2.2 pin functionality vcc1 logic input supply voltage of 3.3 v up to 15 v wide operating range. in+ non inverting driver input in+ non-inverted control signal for driver output if in- is set to low. (output sourcing active at in+ = high and in- = low) due to internal filtering a minimum pulse width is defined to ensure robustness against noise at in+ . an internal weak pull-down-resistor favors of-state. in- inverting driver input in- inverted control signal for driver output if in+ is set to high. (output sourcing active at in- = low and in+ = high) due to internal filtering a minimum pulse width is defined to ensure robustness against noise at in- . an internal weak pull-up-resistor favors of-state. eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package pin configuration and functionality datasheet 5 2.1 2017-09-04
gnd1 ground connection of input circuit. gnd2 reference ground reference ground of the output driving circuit. vcc2 positive power supply pin of output driving circuit. a proper blocking capacitor has to be placed close to this supply pin. out driver output combined source and sink output pin to external igbt. the output voltage will be switched between vcc2 and gnd2 and is controlled by in+ and in- . in case of an uvlo event this output will be switched of and an active shut down keeps the output voltage at a low level. clamp active miller clamp connect gate of external igbt directly to this pin. as soon as the gate voltage has dropped below 2 v referred to gnd2 during turn of state the miller clamp function ties its output to gnd2 to avoid parasitic turn on of the connected igbt. eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package pin configuration and functionality datasheet 6 2.1 2017-09-04
3 functional description the 1edcxxi12mh is a general purpose igbt gate driver. basic control and protection features support fast and easy design of highly reliable systems. the integrated galvanic isolation between control input logic and driving output stage grants additional safety. its wide input voltage supply range supports the direct connection of various signal sources like dsps and microcontrollers. with the rail-to-rail output and the additional active miller clamp, dynamic turn on due to miller capacitance is suppressed. 3.1 supply the driver can operate over a wide supply voltage range. gnd1 in+ in- vcc1 out vcc2 gnd2 clamp +5 v sgnd in +15 v 10r 1 100n figure 4 application example the typical positive supply voltage for the driver is 15 v at vcc2 . erratical dynamic turn on of the igbt can be prevented with the active miller clamp function, in which the clamp output is directly connected to the igbt gate. eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package functional description datasheet 7 2.1 2017-09-04
3.2 protection features 3.2.1 undervoltage lockout (uvlo) out in+ vcc2 vcc1 v uvloh2 v uvlol2 v uvloh1 v uvlol1 figure 5 uvlo behavior to ensure correct switching of igbts the device is equipped with an undervoltage lockout for input and output independently. operation starts only afer both vcc levels have increased beyond the respective v uvloh levels if the power supply voltage v vcc1 of the input chip drops below v uvlol1 a turn-of signal is sent to the output chip before power-down. the igbt is switched of and the signals at in+ and in- are ignored until v vcc1 reaches the power-up voltage v uvloh1 again. if the power supply voltage v vcc2 of the output chip goes down below v uvlol2 the igbt is switched of and signals from the input chip are ignored until v vcc2 reaches the power-up voltage v uvloh2 again. 3.2.2 active shut-down the active shut-down feature ensures a safe igbt of-state if the output chip is not connected to the power supply or an undervoltage lockout is in efect. the igbt gate is clamped at out to gnd2 . 3.2.3 short circuit clamping during short circuit the igbts gate voltage tends to rise because of the feedback via the miller capacitance. an additional protection circuit connected to out and clamp limits this voltage to a value slightly higher than the supply voltage. a maximum current of 500 ma may be fed back to the supply through one of these paths for 10 s. if higher currents are expected or tighter clamping is desired external schottky diodes may be added. 3.2.4 active miller clamp in a half bridge configuration the switched of igbt tends to dynamically turn on during turn on phase of the opposite igbt. a miller clamp allows sinking the miller current across a low impedance path in this high dv/dt situation. therefore in many applications, the use of a negative supply voltage can be avoided. during turn-of, the gate voltage is monitored and the clamp output is activated when the gate voltage drops below typical 2 v (referred to gnd2 ). the clamp is designed for a miller current in the same range as the nominal output current. eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package functional description datasheet 8 2.1 2017-09-04
3.3 non-inverting and inverting inputs out in+ in- figure 6 logic input to output switching behavior there are two possible input modes to control the igbt. at non-inverting mode in+ controls the driver output while in- is set to low. at inverting mode in- controls the driver output while in+ is set to high. a minimum input pulse width is defined to filter occasional glitches. 3.4 driver output the output driver section uses mosfets to provide a rail-to-rail output. this feature permits that tight control of gate voltage during on-state and short circuit can be maintained as long as the drivers supply is stable. due to the low internal voltage drop, switching behavior of the igbt is predominantly governed by the gate resistor. furthermore, it reduces the power to be dissipated by the driver. eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package functional description datasheet 9 2.1 2017-09-04
4 electrical parameters 4.1 absolute maximum ratings note : absolute maximum ratings are defined as ratings, which when being exceeded may lead to destruction of the integrated circuit. unless otherwise noted all parameters refer to gnd1 table 2 absolute maximum ratings parameter symbol values unit note or test condition min. max. power supply output side v vcc2 -0.3 20 1) v 2) gate driver output v out v gnd2 -0.3 v vcc2 +0.3 v 2) maximum short circuit clamping time t clp C 10 s i clamp/out = 500 ma positive power supply input side v vcc1 -0.3 18.0 v C logic input voltages (in+,in-) v logicin -0.3 18.0 v C pin clamp voltage v clamp -0.3 v vcc2 +0.3 1) v 2) junction temperature t j -40 150 c C storage temperature t s -55 150 c C comparative tracking index cti 400 C iec 60601-1: material group ii power dissipation (input side) p d, in C 25 mw 3) @ t a = 25c power dissipation (output side) p d, out C 400 mw 3) @ t a = 25c thermal resistance (input side) r thja,in C 145 k/w 3) @ t a = 85c thermal resistance (output side) r thja,out C 165 k/w 3) @ t a = 85c esd capability v esd,hbm C 2 kv human body model 4) v esd,cdm C 1 kv charged device model 5) 1 may be exceeded during short circuit clamping. 2 with respect to gnd2 . 3 see figure 10 for reference layouts for these thermal data. thermal performance may change significantly with layout and heat dissipation of components in close proximity. 4 according to eia/jesd22-a114-c (discharging a 100 pf capacitor through a 1.5 k series resistor). 5 according to eia/jesd22-c101 (specified waveform characteristics) eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package electrical parameters datasheet 10 2.1 2017-09-04
4.2 operating parameters note : within the operating range the ic operates as described in the functional description. unless otherwise noted all parameters refer to gnd1. table 3 operating parameters parameter symbol values unit note or test condition min. max. power supply output side v vcc2 13 18 v 6) power supply input side v vcc1 3.1 17 v C logic input voltages (in+,in-) v logicin -0.3 17 v C pin clamp voltage v clamp v gnd2 -0.3 v vcc2 7) v 6) switching frequency f sw C 1.0 mhz 8)9) ambient temperature t a -40 125 c C thermal coeficient, junction-top th,jt C 4.8 k/w 9) @ t a = 85c common mode transient immunity |dv iso /dt| C 100 kv/s 9) @ 1000 v 4.3 electrical characteristics note : the electrical characteristics include the spread of values in supply voltages, load and junction temperatures given below. typical values represent the median values at t a = 25c. unless otherwise noted all voltages are given with respect to their respective gnd (gnd1 for pins 1 to 3, gnd2 for pins 6 to 8). 4.3.1 voltage supply table 4 voltage supply parameter symbol values unit note or test condition min. typ. max. uvlo threshold input chip v uvloh1 C 2.85 3.1 v C v uvlol1 2.55 2.75 C v C uvlo hysteresis input chip (v uvloh1 - v uvlol1 ) v hys1 0.09 0.10 C v C 6 with respect to gnd2 . 7 may be exceeded during short circuit clamping. 8 do not exceed max. power dissipation 9 parameter is not subject to production test - verified by design/characterization eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package electrical parameters datasheet 11 2.1 2017-09-04
table 4 voltage supply (continued) parameter symbol values unit note or test condition min. typ. max. uvlo threshold output chip (igbt supply) v uvloh2 C 11.9 12.7 v 10) v uvlol2 10.5 11.0 C v 10) uvlo hysteresis output chip (v uvloh1 - v uvlol1 ) v hys2 0.7 0.85 C v C quiescent current input chip i q1 C 0.6 1 ma v vcc1 = 5 v in+ = high, in- = low => out = high quiescent current output chip i q2 C 1.2 2 ma v vcc2 = 15 v in+ = high, in- = low => out = high 4.3.2 logic input uvlo no driver operation 5 10 15 v vcc1 v in+l ,v in-l v in+h ,v in-h 5 10 v vcc1,max 0.75v 0.35v 0.715v 0.315v 3.3 in+, in- low input voltage, max 0.33.3v in+,in- high input voltage, min 0.73.3v figure 7 vcc1 scaled input threshold voltage of in+ and in- beginning from the input undervoltage lockout level, threshold levels for in+ and in- are scaled to v vcc1 . the high input threshold is 70% of v vcc1 and the low input threshold is at 30% of v vcc1 . 10 with respect to gnd2 . eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package electrical parameters datasheet 12 2.1 2017-09-04
table 5 logic input parameter symbol values unit note or test condition min. typ. max. in+ , in- low input voltage v in+l , v in-l C C 0.3 v vcc1 11) 3.1 v v vcc1 17 v in+ , in- high input voltage v in+h , v in-h 0.7 v vcc1 C C in+ , in- low input voltage v in+l , v in-l C C 1.5 v v vcc1 = 5.0 v in+ , in- high input voltage v in+h , v in-h 3.5 C C v in- input current i in- C 70 200 a v vcc1 = 5.0 v, v in- = gnd1 in+ input current i in+ C 70 200 a v vcc1 = 5.0 v, v in+ = v vcc1 4.3.3 gate driver note : minimum peak current rating valid over temperature range! table 6 gate driver parameter symbol values unit note or test condition min. typ. max. high level output peak current (source) 1EDC10I12MH 1edc20i12mh 1edc30i12mh i out,h,peak 1.0 2.0 3.0 2.2 4.4 5.9 C a 12) in+ = high, in- = low, v vcc2 = 15 v low level output peak current (sink) 1EDC10I12MH 1edc20i12mh 1edc30i12mh i out,l,peak 1.0 2.0 3.0 2.3 4.1 6.2 C a 12) in+ = low, in- = low, v vcc2 = 15 v 11 parameter is not subject to production test - verified by design/characterization 12 specified min. output current is forced; voltage across the device v (vcc2 - out) or v (out - gnd2) < v vcc2 . eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package electrical parameters datasheet 13 2.1 2017-09-04
4.3.4 short circuit clamping table 7 short circuit clamping parameter symbol values unit note or test condition min. typ. max. clamping voltage ( out ) ( v out - v vcc2 ) v clpout C 0.9 1.3 v 13) in+ = high, in- = low, i out = 500 ma (pulse test t clpmax = 10 s) clamping voltage ( clamp ) ( v vclamp - v vcc2 ) v clpclamp1 C 1.3 C v 13) in+ = high, in- = low, i clamp = 500 ma (pulse test t clpmax = 10 s) clamping voltage ( clamp ) v clpclamp2 C 0.7 1.1 v 13) in+ = high, in- = low, i clamp = 20 ma 4.3.5 active miller clamp table 8 active miller clamp parameter symbol values unit note or test condition min. typ. max. low level clamp current 1EDC10I12MH 1edc20i12mh 1edc30i12mh i clamp,peak 1.0 2.0 3.0 C C a 14) in+ = low, in- = low, v clamp = 15 v pulsed t pulse = 2 s clamp threshold voltage v clamp 1.6 2.0 2.4 v 15) 13 with respect to gnd2 . 14 parameter is not subject to production test - verified by design/characterization 15 with respect to gnd2 . eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package electrical parameters datasheet 14 2.1 2017-09-04
4.3.6 dynamic characteristics dynamic characteristics are measured with v vcc1 = 5 v and v vcc2 = 15 v. in+ out t pdon 50% 50% t pdoff 20% 80% t rise t fall figure 8 propagation delay, rise and fall time table 9 dynamic characteristics parameter symbol values unit note or test condition min. typ. max. input in to output propagation delay on t pdon 270 300 330 ns c load = 100 pf v in+ = 50%, v out =50% @ 25c input in to output propagation delay off t pdoff 270 300 330 ns input in to output propagation delay distortion ( t pdoff - t pdon ) t pdisto -30 5 40 ns input pulse suppression time in+ , in- t minin+ , t minin- 230 240 C ns in input to output propagation delay on variation due to temp t pdont C C 14 ns 16) c load = 100 pf v in+ = 50%, v out =50% in input to output propagation delay off variation due to temp t pdofft C C 14 ns in input to output propagation delay distortion variation due to temp ( t pdoff - t pdon ) t pdistot C C 8 ns rise time t rise 5 10 20 ns c load = 1 nf v l 20%, v h 80% fall time t fall 3 9 19 ns 4.3.7 active shut down table 10 active shut down parameter symbol values unit note or test condition min. typ. max. active shut down voltage v actsd C 2.0 2.3 v 17) i out- / i out-,peak =0.1, vcc2 open 16 parameter is not subject to production test - verified by design/characterization 17 with respect to gnd2 . eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package electrical parameters datasheet 15 2.1 2017-09-04
5 recognized under ul 1577 (file e311313) table 11 recognized under ul 1577 description symbol characteristic unit insulation withstand voltage / 1 min v iso 2500 v (rms) insulation test voltage / 1 s v iso 3000 v (rms) eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package recognized under ul 1577 (file e311313) datasheet 16 2.1 2017-09-04
6 package outline figure 9 pg-dso-8-59 (plastic (green) dual small outline package) eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package package outline datasheet 17 2.1 2017-09-04 0.252 0.104 0.020 0.013 0.417 0.299 0.035 0.018 millimeters l h ccc ddd d dim a2 a b c e e1 n e - min 8 0.020 0.004 0.010 0.010 2.45 max inches 8 0.050 bsc 0.244 min - 0.089 0.012 0.009 0.394 0.291 max 0.096 scale 2 0 4mm 0 2 2.25 2.65 0.50 0.32 6.40 10.60 7.60 7.40 10.00 6.20 0.23 0.30 0.90 0.50 0.45 0.25 0.25 0.10 1.27 bsc 01 issue date 05.11.2015 document no. z8b00179262 european projection revision a1 0.20 0.004 0.008 0.10 , ? ? ? ? l2 0.25 bsc 0.010 bsc
7 application notes 7.1 reference layout for thermal data figure 10 reference layout for thermal data (copper thickness 35 m) this pcb layout represents the reference layout used for the thermal characterization. pin 4 ( gnd1 ) and pin 5 ( gnd2 ) require each a ground plane of 100 mm2 for achieving maximum power dissipation. the package is built to dissipate most of the heat generated through these pins. the thermal coeficient junction-top ( th,jt ) can be used to calculate the junction temperature at a given top case temperature and driver power dissipation: t j = th,jt ? p d + t top 7.2 printed circuit board guidelines the following factors should be taken into account for an optimum pcb layout. ? suficient spacing should be kept between high voltage isolated side and low voltage side circuits. ? the same minimum distance between two adjacent high-side isolated parts of the pcb should be maintained to increase the efective isolation and to reduce parasitic coupling. ? in order to ensure low supply ripple and clean switching signals, bypass capacitor trace lengths should be kept as short as possible. revision history document version date of release description of changes 2.1 2017-09-04 increase of typical gate driver output current values; formatting updated for electrical parameters and pins 2.0 2017-07-17 ul file number added 1.0 2017-03-28 comparative tracking index added 0.5 2016-10-04 initial version eicedriver ? 1edc compact single channel igbt gate driver ic with clamp in wide body package application notes datasheet 18 2.1 2017-09-04
trademarks all referenced product or service names and trademarks are the property of their respective owners. edition 2017-09-04 published by infineon technologies ag 81726 munich, germany ? 2017 infineon technologies ag all rights reserved. do you have a question about any aspect of this document? email: erratum@infineon.com document reference ifx-wsq1467702399192 important notice the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (beschafenheitsgarantie) . with respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. in addition, any information given in this document is subject to customers compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customers products and any use of the product of infineon technologies in customers applications. the data contained in this document is exclusively intended for technically trained staf. it is the responsibility of customers technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. warnings due to technical requirements products may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies ofice. except as otherwise explicitly approved by infineon technologies in a written document signed by authorized representatives of infineon technologies, infineon technologies products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury

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